2011-08-22
评论6
楼主 2011/8/22 17:05:47
最简单不过了，可不要再去钻牛角尖哦！
符合欧姆定律
接触器线圈电流就是线圈电压除以线圈电阻！
楼主 2011/8/23 8:42:35
电阻是多少呢?
楼主 2011/8/23 12:21:18
如若样本资料也未作任何具体交代，接触器的线圈电阻在使用（设计选用）前就得麻烦您自己具体去测量一下了。
计算完全依据欧姆定律:
线圈电流=线圈电压/线圈电阻！
就这么简单哦！
楼主 2012/8/28 15:01:50
是很简单，不过这些厂家最好在产品说明里表明一些电感 电阻值，不然要计算一些数据的时候，还得去查。
楼主 2012/10/5 21:26:02
猎头为飞思卡尔半导体中国有限公司寻找Linux Packaging and Release Engineer for Linux R&D
我是www.eepeople.com 猎头顾问Nicole Li。www.eepeople.com 是面向电子/电气工程行业人员的人脉社交网站，有大量500强公司如英特尔、高通、IBM、GE、GM、德州仪器等的要求2-5年经验的技术职位。也有EE/IT行业的薪酬报告供您参考。
现在飞思卡尔半导体中国有限公司急招一名Linux Packaging and Release Engineer for Linux R&D ，具体信息如下：
职位名称 Linux Packaging and Release Engineer for Linux R&D
公司 飞思卡尔半导体中国有限公司
职能部门 研发中心/R&Dg
职位所在城市 Beijing
职位所需经验 5年
职位描述
Department Description
Linux R&D is to provide solid Linux technology support for Freescale's 32bit/64bit silicons and reference boards, including SDK, SW customer support and reference SW. It is a global teams including sites from US, <st1:country-region w:st="on">Canada, <st1:country-region w:st="on">Israel, <st1:country-region w:st="on">Romania, <st1:country-region w:st="on">China, <st1:country-region w:st="on">India. The mission of this department is to provide SW support for NPD and WAD in NMSG.
Scope of Responsibilities / Expectations
The Linux Packaging and Release Software Engineering position is a key role within the Linux R&D team. This position will be capable of qualified Linux SDK packaging and release work for Freescale’s 32bit/64bit silicon/boards. Meanwhile, it will maintain and enhance the Linux SDK release infrastructure to leverage the efficiency on marketing delivery with high quality. After the SDK or SW released, the engineer is also responsible to support customer and field support teams for packaging tools issue and requests. As a key position for Linux R&D, this position works closely with global Linux R&D teams to timely accomplish planned Linux SDK work proactively. As a packaging tool maintenor, this role also works proactively with opensource commitee to timely align newly added feature for packaging tools, and submit enhancement/issues to opensource to collaborations.
The engineer will work under Freescale Linux R&D team in Beijing.
职位所需技能
?Minimum BSEE or BSCS, Masters Preferred.
?Minimum of 5 years of strong work experience in system configuration, packaging, and release on Linux and embedded system for BSP and solutions.
?Ideal candidates will have demonstrated capability building Software Packaging, Production and Release on Linux SDK/BSPs.
?Strong knowledge of software configuration, packaging and release infrastructure and tools development and maintenance. Yocto technology is preferable.
?Strong script language programming skills, such as Python, Perl, Expect, Shell
?Strong knowledge of embedded system programming for Linux/Unix kernel, device drivers. Multiple-core technology is preferred.
?Strong program skills in C++/Java, OOD/OOP is preferred.
?Familiar with any of the following processors architecture: PowerPC, ColdFire, ARM, and MIPS. Perfer to have multi-core knowledge.
?Knowledge and understanding of common Open Source software development and release practices.
?Excellent interpersonal and communication skills, good teamwork adaptability, good oral and written English skills, self-motivated. Ideal candidates will have international experience.
除上述职位外, www.eepeople.com 还有更多类似技术职位，并有众多名企的面试题和薪酬报告供您参考。有意者请将中英文简历发至这邮箱: nicoleli_nl01@163.com， 也可在www.eepeople.com上找到我并在线联系。
楼主 2012/10/6 9:02:09
怎样提出广告
